Viresh Patel

Viresh Patel is a seasoned professional in the semiconductor and assembly engineering sectors, currently serving as a Board Member at CG SEMI Private Limited and Andromeda 360, Inc. Since March 2019, Viresh has held the position of Vice President and Head of the Global Packaging & Assembly Division at Renesas Electronics, previously serving as Senior Director in the Production Technology Unit. Viresh's extensive experience includes significant roles at IDT - Integrated Device Technology, Maxim Integrated Products, and Integral Wave Technologies, focusing on assembly operations and packaging engineering. Viresh began a career in engineering in 1993, with positions at Cirrus Logic and Cherry Semiconductor, following a Bachelor's degree in Mechanical Engineering from the University of Massachusetts Amherst.