Enrique Espinosa

Enrique Espinosa is a highly skilled Sr. Advance Packaging Engineer at Resideo since July 2022, with extensive experience in packaging engineering and program management across various industries. Prior roles include Sr. Packaging Engineer at TE Connectivity and Nexteer Automotive, where responsibilities encompassed packaging design coordination for new product introductions, project management, cost reduction initiatives, and supplier engagement. With expertise in Solid Works and Solid Edge modeling software, Enrique has effectively led projects to improve product quality and efficiency while implementing advanced packaging standards. Enrique's career also includes packaging roles at Strattec Security Corporation, Delphi, and Visteon Corporation, focusing on design validation, budget management, and continuous improvement initiatives. Enrique holds a degree in Electrical Engineering from Universidad Autónoma de Ciudad Juárez.