Matthew Kurtz is an accomplished Engineering Manager at Rochester Electronics, where responsibilities include overseeing Package Engineering, Subcontractor Assembly, and Plastic Assembly since August 2013. Previously, Matthew served in various engineering roles at TTM Technologies from June 2010 to June 2013, significantly enhancing the Develop-Etch-Strip process for printed circuit boards and contributing to quality improvement efforts. Matthew's academic background includes a Bachelor of Science in Chemical Engineering from Worcester Polytechnic Institute, complemented by a nanoscience minor, and experience as a summer intern at Texas State University, where innovative etching solutions for silicon dioxide were developed.
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