Mario Ciminelli

Mario Ciminelli is a seasoned engineering professional with extensive experience in photonics packaging, micro-electronic design, and sensor technology. Currently serving as a Photonics Packaging Engineer in Research & Development at the Rochester Institute of Technology since 2018, Mario focuses on developing processes for fiber and die attach and device packaging designs. Previously, as Program Manager at OLEDWorks LLC, Mario evaluated electronic drivers for compatibility with OLED light panels. Prior roles at Eastman Kodak Company included Sensor Reliability Engineer, where reliability testing of Micro 3D Printed Touch Sensors was conducted, and Sr. Micro-Electronic Packaging Engineer, emphasizing MEMS inkjet print head design. Mario also held principal engineering positions at Measurement Specialties, Inc., and began a career at ABB Kent-Taylor, contributing to industrial process control solutions. Mario holds a Bachelor of Science degree in Mechanical Engineering from the Rochester Institute of Technology.