Rockley Photonics
Isaac L. is a skilled professional with extensive experience in engineering and process development. Currently serving as Chip Integration Lead at Rockley Photonics Inc. since December 2019, Isaac has previously held the position of Senior Process Engineer at ASM Pacific Technology Ltd. from April 2012 to January 2019, where responsibilities included developing machine automation and refining processes for camera module assembly. Earlier experience as a Solution Engineer at Lucky Engineering Company Limited involved designing and implementing monitoring systems. Isaac holds a Bachelor’s Degree in Electronic and Information Engineering from The Hong Kong Polytechnic University and a Master’s Degree in System Engineering and Engineering Management from The Chinese University of Hong Kong.
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