Dan Dawiedczyk

Dan Dawiedczyk currently serves as the President of the PCB Division at Sanmina, a position held since May 2025. Prior to this role, Dan was the President of GHSP from 2021 to 2024, leading a $300 million global organization through significant transformation, focusing on product strategy and customer base diversification. Dan has also held key leadership roles at Aptiv, overseeing a $1.4 billion division, and at Molex, where Dan managed the Printed Circuit Solutions business unit. Dan’s extensive experience in various engineering and managerial capacities, supported by a Bachelor's degree from Marquette University and a Master's degree from the Illinois Institute of Technology, showcases a strong background in electrical and electronics engineering, business development, and operational management across multiple global markets.