Sarcina Technology LLC
Larry Zu, Ph.D., is the Chief Executive Officer and President of Sarcina Technology LLC, overseeing a comprehensive service model catering to top companies in the semiconductor and IT sectors since October 2011. Prior experience includes serving as Senior Director of Engineering & Business Development at GUC, where semiconductor product engineering was conducted for a leading networking company. Larry's expertise extends to GPU package design at TSMC, engineering management at Intel Corporation with a focus on microprocessor packages, and roles at Digital Equipment Corporation and AT&T Bell Laboratories. Academic credentials include a Ph.D. in Electrical and Computer Engineering from Rutgers University and a Bachelor of Science in Physics from Peking University.
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Sarcina Technology LLC
Founded in 2011, Sarcina Technology is a semiconductor packaging company in Palo Alto, California, USA with a design office in Hsinchu, Taiwan. It is led by industrial veterans from places like AT&T Bell Labs, DEC, Intel and TSMC. Sarcina Technology provides leading US companies with package design and power/signal integrity simulation. In addition, Sarcina offers final test hardware design, program development, and one-stop turnkey service. We work with the world's foremost foundries to ensure high quality products. We've handled everything, from the simplest to the most complex of packages. Our results are self-evident: since its formation, Sarcina's tapeouts have all been first-time successes.