Mike Smith

Mike Smith has a diverse and extensive work experience spanning several industries. Mike is currently serving as the Senior Vice President / GM of Schneider Packaging Equipment at Pacteon Group, where they oversee packaging line solutions and customer experience. Prior to this, they held the role of Senior Vice President / Owner at Schneider Packaging Equipment Co., Inc., where they were responsible for end-of-line automation solutions. Mike also served as the VP Engineering and Services / Owner at Schneider Packaging Equipment Co., Inc. Mike has also been a part of the RIA Board of Advisors at the Robotic Industries Association, a Board Member at Intel Corporation, and held leadership positions at Arrow Electronics and Seneca. Additionally, they have served as an Advisory Board Member at NVIDIA and Onondaga Community College, and worked as a Senior Systems Engineer at Silicon Graphics. At CADimensions, Inc., Mike held the position of VP Technical Services, contributing to the growth of the company as a CAD/CAM reseller.

Mike Smith attended Syracuse University and completed their education there. However, the specific degree and field of study are unknown. Prior to their time at Syracuse, Mike also attended Onondaga Community College, but did not obtain a degree. Mike completed their high school education at Henninger High School. No further information about their education history is provided.