SEMIgear, Inc.
Andrew Hornak is an experienced engineering professional specializing in semiconductor capital equipment design and product development. Currently serving as the R&D ME/EE Manager at Semigear, Inc. since September 2017, Andrew leads innovation in the packaging processes for microprocessors and manages a skilled workforce in semiconductor processing equipment development. Prior roles include Senior Mechanical Engineer at Axcelis Technologies, R&D Senior Mechanical Engineer at Applied Materials/VSE, and multiple engineering positions at Varian Semiconductor, where Andrew focused on various aspects of mechanical design, project management, and component evaluation. Earlier experience includes project leadership in mechanical design at Andrews Engineering and significant contributions as Principal Mechanical Engineer at General DataComm Ltd., where Andrew engineered products for telecommunications. Andrew holds a Bachelor of Science in Mechanical Engineering from the University of New Haven.
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SEMIgear, Inc.
SEMIgear designs, develops, markets, and manufactures semiconductor wafer processing and packaging equipment. SEMIgear’s product portfolio consists of fully automated wafer level processing equipment, GENEVA STP (Serial Thermal Processor) and STP 300 series for the semiconductor front-end and back-end applications as well as fully automated chip or PCB level processing equipment, and VIENNA LTP (Linear Thermal Processor) series for back-end and assembly applications.