Payam Haghparast

Payam Haghparast, PhD, is an experienced IC Packaging Specialist and Thermal and Mechanical Analyst at Semtech since May 2021, focusing on thermal analysis and mechanical simulation. Prior to this role, Payam served as a Simulation Analyst at the Institut interdisciplinaire d'innovation technologique from January 2019 to May 2021, specializing in CFD and FEA simulations, as well as advanced thermomechanical optimization of microelectronic packages. Payam's academic background includes a PhD in Mechanical Engineering from Université de Sherbrooke, where involvement included CFD simulation and energy efficiency design. Additionally, Payam has a Master's and Bachelor's degree in Mechanical Engineering from Ferdowsi University of Mashhad and Shahid Bahonar University of Kerman, respectively. Previous work experience includes roles as a Mechanical Engineer at Monenco Iran Consulting Engineers and an Instructor at the Technical and Vocational Researches Training Center.