James Card

James Card is an accomplished Electronics Packaging Design Manager and Distinguished Member of Technical Staff at Sensata Technologies since April 2006, leading a global team in the development of sensor products for various applications including automotive electrification. Prior to this role, James served as a Senior Member of Technical Staff and Sr. Process Engineer at Texas Instruments, where contributions included the development of the first known flip chip on flex circuit for automotive applications and supporting multiple product lines that generated over $1 billion in annual revenues. James began a career in microelectronics packaging as a Microelectronics Packaging Engineer at Raytheon, advancing to technical lead and specializing in processes such as die attach and hermetic packaging. James's early experience as a Production Engineer at Technic Inc involved managing precious metal flake manufacturing and implementing quality systems. Academic credentials include an MS in Materials Science and Engineering from the University of California, Berkeley, and a BS in Materials Engineering from Rensselaer Polytechnic Institute.