David Pustan

Senior MEMS Packaging Engineer at Sensirion

David Pustan started their work experience in 2004 as a Doctorate/Research Assistant at the University of Freiburg. David held this role until December 2010. In 2011, they joined Sensirion AG as a MEMS Packaging Engineer. David later became a Senior MEMS Packaging Engineer in January 2015. The end dates for their roles at Sensirion have not been provided.

David Pustan completed their education at the University of Freiburg. From 1999 to 2004, they pursued their Bachelor's degree in Microsystems Engineering, acquiring a Dipl.-Ing. Upon completion of their undergraduate studies, they continued at the same institution, the University of Freiburg, from 2004 to 2011. During this period, they obtained a Doctor's degree in Engineering (Doktor der Ingenieurwissenschaften) in the Department of Microsystems Engineering - IMTEK.

Links


Timeline

  • Senior MEMS Packaging Engineer

    January, 2015 - present

  • MEMS Packaging Engineer

    January, 2011