Vincent Lai is the Head of Solution Engineering at SICK Sensor Intelligence, bringing over seven years of automation experience and four years of team management and development to the role. Previously, Vincent held various positions in semiconductor-related companies, including Process Engineer at 友達光電 and Field Service Engineer at 科林研發. Vincent also earned a Bachelor's degree in Mechanical Engineering from 國立聯合大學 and a Master's degree in Marine Sciences from 國立中央大學.
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