Donghwan Kim

Donghwan Kim has worked in various roles since 2007. In 2007, they were an Undergraduate Research Assistant at the Illinois Institute of Technology, where they reverse-engineered a dune buggy to redesign the crank case of its engine to modify the conventional engine to hybrid engine. In 2008, they were a Graduate Research Assistant and Teaching Assistant at The University of Texas at Austin. As a Graduate Research Assistant, they performed modal and harmonic analysis for MEMS devices to enhance their performance and optimize their design, as well as fabricating prototype MEMS devices and testing fabricated devices. As a Teaching Assistant, they introduced basic backgrounds of sensors and controls and used LabVIEW to simulate results and verify the simulations by doing actual experiments. In 2014, they were a Summer Engineering Intern at Silicon Audio. From 2015 to present, they have been an R&D Engineer at Silicon Audio, where they have been working on projects such as force-feedback optical seismometers, shear-stress and pressure sensors for supersonic/hypersonic wind-tunnel tests, and piezoresistive infrasound transducer and acoustic packaging.

Donghwan Kim received their B.S. in Mechanical Engineering from Inha University between 2000 and 2008. Donghwan then attended the Illinois Institute of Technology from 2006 to 2008, where they obtained their B.S. in Mechanical Engineering with a minor in Aerospace. Donghwan continued their education at The University of Texas at Austin from 2008 to 2010, earning an M.S.E. in Mechanical Engineering - Dynamic Systems and Control. Donghwan concluded their studies at The University of Texas at Austin in 2018, receiving their Doctor of Philosophy (Ph.D.) in Mechanical Engineering - Dynamic Systems and Control. Additionally, they hold an Enrolled Professional Engineer Intern certification from the Department of Financial and Professional Regulation, State of Illinois.