Hongbin Wei

Hongbin Wei has extensive work experience in the semiconductor industry. From 2009 to 2012, they worked as a Staff Engineer at Samsung Information System America. Hongbin then moved to Samsung Semiconductor Inc., where they held various roles from 2012 to 2019. These roles included Staff Firmware Engineer, Senior Staff Engineer, Senior Manager, Director of Engineering, and Principal Engineer. In 2019, they joined SK hynix memory solutions inc. as a Sr. Principal Engineer.

Hongbin Wei attended the University of Science and Technology of China where they pursued a Bachelor of Science degree in Physics. The exact duration of their education and any other educational experiences beyond this information are unknown.