Guy Smith has extensive experience in engineering and management in the electronics and aerospace sectors. Currently serving as Technical Director and Principal Microelectronics Packaging Engineer at Skyworks Solutions, Inc., and Senior Manager at pSemi, a Murata Company, Guy has held significant leadership roles, including Director of NPi Packaging and Assembly at pSemi and Principal Mechanical Engineer at Collins Aerospace since December 2018, where Guy also functions as a hardware design tools architect. Prior to these roles, Guy was a Principal Mechanical Engineer at Rockwell Collins from 1997 to 2013. Guy holds two Bachelor of Science degrees in Engineering and Mechanical Engineering from Iowa State University, earned between 1995 and 2000.
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