Bill Chuan is a seasoned field applications engineering professional with extensive experience across various technology sectors, including cloud computing, storage, and telecommunications. Currently serving as a Field Applications Engineer at Solidigm since April 2022, Bill specializes in customer engagement, opportunity development, and product demonstrations. Previous roles include Senior Manager of Field Applications Engineering at AMD, where Bill led a team servicing cloud service providers, and Director of Sales and Field Applications Engineering at Flex, focusing on enterprise technology solutions. Bill's earlier experience at Intel Corporation involved serving as Sr. Technical Account Manager and Sr. Technical Marketing Engineer, where responsibilities included driving revenue and managing technical solutions. Bill's technical foundation was built through positions at TriPoint Global and as an Electronic Engineer in the US Army. Bill holds a Bachelor of Science in Electrical and Electronics Engineering from California Polytechnic State University-San Luis Obispo.
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