Laasya Vadlamani is a Firmware Engineer at Solidigm, specializing in Solid State Drives within the NonVolatile Solutions Group since December 2021. Previously, Laasya served in a similar role at Intel Corporation from August 2021 to January 2022 and worked as an IoT Firmware Engineer and Research and Development Intern at Weber-Stephen Products LLC from May 2018 to July 2021. Additional experience includes serving as a Research Assistant at Northern Illinois University, where Laasya worked on a project focused on remote detection of temperature-related anomalies in humans, and summer internships at Honeywell and Mamidipudi Venkatarangaiya Foundation. Laasya holds a Master's degree in Electrical and Electronics Engineering from Northern Illinois University and a Bachelor of Technology in Instrumentation and Control from Manipal Institute of Technology.
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