Riccardo Villa

Riccardo Villa is a Process Engineering Manager at STMicroelectronics, where they lead Chip Package Interaction activities and the development of new process technologies in semiconductor packaging. Previously, Riccardo served as a Process Team Leader, managing a team of engineers focused on wire bonding process development, and they are Lean Six Sigma Black Belt certified. Riccardo also held roles as a Wire Bonding Process Engineer and worked at Freudenberg Politex and ABB. They earned both a Master’s and Bachelor’s degree in Materials Engineering from Politecnico di Milano, achieving the highest honors in both.