Eynav Eliash

Eynav Eliash is a skilled professional in materials chemistry and engineering with diverse experience in research and development. Currently serving as the Head of R&D Formulation and R&D Project Manager at Sufresca since January 2023, Eynav previously worked at Intel Corporation as a Process Engineer, where responsibilities included managing critical thin film deposition processes and conducting failure analysis. Prior roles include R&D Materials Engineer at Nano Dimension, where Eynav focused on conductive ink development and scaling manufacturing processes. Eynav's academic background includes a Master of Science in Materials Chemistry from the Weizmann Institute of Science and a Bachelor's degree in Materials Science and Engineering with Chemistry from Tel Aviv University. Additional experience includes work as a Quality Engineer at SII and analytical roles within the Israeli Intelligence Corps.