Dipen D.

Application Packaging Analyst & SCCM

Dipen D. is an experienced Application Packaging Analyst and SCCM at Sulzer since June 2019, with previous roles as an Application Packager at Wipro Technologies and SCCM Packaging Engineer at MAHLE HOLDING (INDIA) PRIVATE LIMITED. Prior experience includes a consulting position at Capgemini and a role as a Software Tester at En Route Media. Dipen holds a Bachelor of Engineering degree in Electrical, Electronics and Communications Engineering from the University of Mumbai.

Links

Previous companies


Org chart

No direct reports

Teams

This person is not in any teams


Offices

This person is not in any offices