Summit Interconnect
Ehsan Golpa is a skilled IT professional currently serving as a Group IT Specialist at Summit Interconnect since August 2022. With previous experience as a Technical Specialist at University Health Network and multiple roles as a Network System Technician at companies such as Bluum, Ingram Micro, and Insight Solutions, Ehsan has developed a strong technical foundation in networking and systems administration. Ehsan began the career at Pirasys as a System Network Administrator and holds a Bachelor's degree in Computer Software Engineering from Azad University, complemented by studies at CEGEP - John Abbott College.
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Summit Interconnect
Summit Interconnect is one of the leading providers of complex, rigid, and flexible printed circuit boards in North America, offering solutions ranging from advanced prototyping to high mix, low-to-mid volume production. Summit serves customers across the aerospace, defense, and other highly demanding commercial sectors and has facilities in California, Illinois, and Toronto, Canada. Summit is a recognized industry leader in quick-turn manufacturing and has expertise with a wide range of materials like high-speed digital, RF/microwave, and mixed constructions.