Chia Hao Kang

Chia Hao Kang is a seasoned professional in package engineering with extensive experience in process and integration engineering, project management, and customer relations. Currently a Staff Package Engineer at 新思國際科技有限公司, they focus on establishing package materials and processes to meet quality and performance standards. Previously, they served as a Principal Engineer at NXP Semiconductors and 恩智浦半導體, where they led projects in OSAT management and quality improvement. Chia Hao earned a Master’s degree in Physics from 國立成功大學 and is pursuing further studies at 國立高雄師範大學.