Chih-I Wei is currently a Principal Member of Technical Staff at 新思科技股份有限公司, where they coordinate EUV modeling and various OPC projects for advanced semiconductor nodes. With significant hands-on experience in lithography, verification, and SMO processes, Chih-I has contributed to over 20 conference papers and 2 journal articles focused on EUV OPC modeling and stochastic failure analysis. They previously held roles as a Section Manager and Staff Engineer at 聯華電子股份有限公司 and as a Product Engineer at Siemens Digital Industries Software. Chih-I holds a Bachelor's degree and a Master of Science in Physics from 國立成功大學 and 國立臺灣大學, respectively.
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