宜陵 林 is a Field Application Engineer with extensive experience in the semiconductor industry. They worked as a Physical Verification Engineer at 瑞昱半導體股份有限公司 from 2018 to 2020, where they gained expertise in chip integration and physical verification processes. They then served as a Product Validation Engineer at 新思科技股份有限公司 from 2020 to 2022, validating EDA tools and conducting quality assurance across advanced technology nodes. Currently, they are a Senior Application Engineer at 新思科技, managing the deployment of EDA tools and providing custom solutions for various clients. 宜陵 林 holds a Bachelor of Science from 靜宜大學 and a Master of Science from 國立中山大學.
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