Connor Schafran is an accomplished sales professional currently serving as an Inside Sales Representative at Sysdig, where responsibilities include managing the full sales cycle and supporting account executives with a quota that is tied to their closed wins. Notably, Connor achieved 140% quota attainment in the first quarter at Sysdig and maintained an average of 150% in FY24. Previous experience includes a successful tenure at Atheer as a Business Development Representative, leading the team in booked meetings, and exceeding quotas through effective engagement with mid-market and enterprise prospects. Earlier roles as a Packaging Engineer at TechFlex Packaging and an Account Executive at Victory Packaging provided a strong foundation in technical processes and sales growth, highlighted by closing significant deals. Connor earned a Bachelor's Degree in Packaging Science with a Minor in Environmental Sustainability from Michigan State University.
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