Avshalom Ben Dalak

Information System & MES Manager at Tadbik

Avshalom Ben Dalak is an experienced Information Systems & MES Manager currently at Tadbik since April 2025. Prior to this role, Avshalom worked at Pi-Cardia from March 2022 to April 2025, focusing on the implementation and development of information systems, MES, and business process automation using Microsoft Excel and VBA. Avshalom gained initial experience as a Customer Success Intern at Next Plus from December 2021 to October 2023. Academic credentials include a Bachelor of Applied Science in Industrial Engineering from Ariel University, completed in August 2023, following a high school diploma from Nechalim High School in June 2013. Avshalom’s background also includes military service as a Tank Gunner in the Israel Defense Forces from August 2015 to March 2018 and serving as an Israeli Emissary at Bnei Akiva Schools of Toronto during the 2014-2015 academic year.

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Tadbik

Tadbik is a world leader of advanced Flexible Packaging, Labels, RFID, Reflective thermal insulation, and in-pack promotion. For over thirty years we’ve worked closely with global clients to pioneer the industry’s innovations. With state-of-the-art production facilities and highly skilled in-house design and engineering teams, we thrive on transforming great new concepts into highly attractive products. Always pushing ourselves and our technologies to the next level, we constantly develop new applications to help clients brand and sell their products in an increasingly competitive marketplace. Operating on four continents, with a reputation for on-time, in-budget delivery of consistently superior products backed by personalized customer service, Tabdik is the partner of choice for global brands in the Food & Beverage, Cosmetics, Healthcare & Pharmaceutical, Food Supplements, Home Furnishings and many other industries. Tadbik maintains the highest international standards of food safety, occupational health and safety, and environmental responsibility. Here to serve you, we’re ready to take on the next challenge of the ongoing packaging evolution.