David Wolfgang

David Wolfgang is a seasoned manufacturing engineer with extensive experience in the electroplating and stamping industries. Currently serving as the Principal Manufacturing Engineer - Plating at TE Connectivity since March 2013, David leads global teams in the installation, qualification, and improvement of processes and equipment. Prior roles include Project Manager Engineering for aerospace and defense projects and APU Manager for stamping and plating at FCI, where David oversaw a $30 million production unit and implemented continuous improvement initiatives. With a career beginning in 1985, David has held various technical positions, advancing from Electroplating Lab Technician to managerial roles, demonstrating a strong background in manufacturing operations, project management, and process engineering. David holds a Bachelor of Science degree in Biochemistry from The Pennsylvania State University.