ML

Michael Lintao

ENGINEERING SECTION HEAD – Power Module, Hermetics and Die Visual Inspection Lines at Team Pacific Corporation

Michael Lintao has a strong background in engineering and technical program management. Michael started their career in 1997 as a Die Attach Process Engineer at Team Pacific Corporation, where they provided support to the Hermetics line and worked on cost-saving projects. Michael then moved to Tong Hsing Electronics (Philippines), Inc., where they served as a Process Development Engineer and later as a Front of Line Process Lead Engineer.

In 2002, Lintao joined PSI Technologies Inc. as a Qualification Engineer III, working in the Central Engineering Department. Michael then joined Team Pacific Corporation again in 2003, this time as a Senior Qualification Engineer in the Engineering Department. Michael was later promoted to Engineering Section Head roles, first in the New Package and Material Qualification Group and then in the Power Module, Hermetics, and Die Visual Inspection Lines.

From 2011 to 2013, Lintao served as the Engineering Section Head of the R&D, New Package and Material Qualification Group at Team Pacific Corporation. Michael led a team responsible for the development of new packages and acted as an interface between marketing, purchasing, manufacturing, and suppliers.

Since 2015, Lintao has been working at PT Unisem, where they hold the position of Technical Program Management - Section Head. In this role, they work closely with customers to meet their technical requirements and coordinates with various internal teams to improve processes and systems. Michael also handles equipment strategy programs to ensure smooth operations and prevent line downtime.

Lintao's most recent position is Senior Industrialization Engineer at Integrated Micro-Electronics, Inc, which they started in 2017.

From 1992 to 1997, Michael Lintao attended the University of the East where they obtained a Bachelor of Science degree in Electronics and Communications Engineering. No further information has been provided regarding their field of study during this time.

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Timeline

  • ENGINEERING SECTION HEAD – Power Module, Hermetics and Die Visual Inspection Lines

    November, 2013 - present

  • ENGINEERING SECTION HEAD – R&D, New Package and Material Qualification Group

    March, 2011

  • ENGINEERING SECTION HEAD –New Package and Material Qualification Group

    February, 2007

  • SENIOR QUALIFICATION ENGINEER – Engineering Department

    February, 2003

  • DIE ATTACH PROCESS ENGINEER I – Hermetics Department

    May, 1997

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