Telink Semiconductor
Haipeng Jin is currently serving as a Member Board of Directors at Bluetooth SIG and the Cofounder at Telink Semiconductor. Prior to this, attended Tsinghua University as a researcher in the Broadband Switching Division, and later went on to work at Qualcomm Inc. as a Senior/Staff/Senior Staff Engineer. Haipeng holds a Ph.D. in Communication Theory and Systems from UC San Diego, as well as a B.S. in Electrical Engineering from Tsinghua University.
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Telink Semiconductor
Telink Semiconductor is a fabless integrated circuit design company with offices in California, Shanghai, Shenzhen, Taiwan, and Hong Kong. Telink is dedicated to the development of highly integrated low-power radio-frequency and mixed signal system chips for Internet of Things applications. Telink’s product portfolio is aimed at serving markets ranging from smart lighting to home automation to smart cities, and currently includes 2.4Ghz RF SoCs for Bluetooth® Smart, Zigbee, 6LoWPAN/Thread, and Homekit. Telink leverages its world class core team with both oversea and local talents, and is striving to become a world-leading semiconductor company. With constant innovation, Telink Semiconductor continuously provides system-level IoT chips to its customers with rapid time-to-market and exceptional added values.