Daniel Engel

Daniel Engel is a Senior Hardware Engineer at Teradyne since March 2019, bringing a wealth of experience from previous roles as a Design Engineer at Senva, Inc. (July 2013 - February 2019) and as an Electrical Design Engineer at Garmin International (August 2007 - February 2012). Daniel's early career includes an internship as a Customer Applications Intern at Maxim Integrated Products in June 2006, where expertise in signal integrity data collection for analog, RF, and mixed signal devices was developed. Daniel holds a Bachelor of Science degree in Electrical, Computer, and Mechanical Engineering from LeTourneau University, attained in 2007.