Deiva S

Deiva S is a highly experienced engineering professional specializing in IC packaging design and development, currently serving as a Staff IC Packaging Engineer at Tesla since August 2021. Prior to this, Deiva held the position of Principal IC Packaging Engineer at Semtech from May 2023 to March 2025, focusing on wafer and panel level packaging for consumer and automotive applications. Deiva's tenure at Skyworks Solutions, Inc. from May 2017 to August 2021 involved microelectronics packaging design for automotive and RF applications. Earlier experience includes leadership as the Head of Engineering and Operations at SPEL, where Deiva oversaw product and process development, and as an Assembly Engineer at STATS ChipPAC Ltd. in Singapore, with a focus on new product development and qualification.