Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up, and spec to the product. With 3000+ employees worldwide, Tessolve provides a one-stop-shop solution with full-fledged hardware and software capabilities, including its advanced silicon and system testing labs.  
 
Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. Tessolve’s design services include solutions on advanced process nodes with a healthy eco-system relationship with EDA, IP, and foundries. Our front-end design strengths integrated with the knowledge from the backend flow, allows Tessolve to catch design flaws ahead in the cycle, thus reducing expensive re-design costs, and risks. We actively invest in the R&D center of excellence initiatives such as 5G, mmWave, Silicon photonics, HSIO, HBM/HPI, system-level test, and others.        
 
Tessolve also offers end-to-end product design services in the embedded domain from concept to manufacturing under an ODM model with application expertise in Avionics, Automotive, Industrial and Medical segments. Tessolve’s Embedded Engineering services enable customers a faster time-to-market through deep domain expertise, innovative ideas, diverse embedded hardware & software services, and built-in infrastructure with world-class lab facilities.
 
Tessolve’s clientele includes Tier 1 clients across multiple market segments, 7 of the top 10 semiconductor companies, start-ups, and government entities. We have a global presence with office locations in the United States, India, Singapore, Malaysia, Germany, United Kingdom, China, UK, Japan, Thailand, Philippines, and Test Labs in India, Singapore, Malaysia, Austin, San Jose.    

Automotive

Industrial

Semiconductor

Tessolve

Srini Chinamilli

Mike Bartley

Rajakumar D.

Rajesh Vaddempudi

Madhav Rao

Huzefa Cutlerywala

Veerappan V

Raghavendra Jha

The Engineering Team at Tessolve is responsible for developing, refining, and deploying advanced silicon and system testing solutions. This includes front-end and back-end design services for ASIC, product design in the embedded domain, and end-to-end solutions that minimize design flaws and reduce redesign costs. The team actively engages in R&D initiatives in areas such as 5G, Silicon photonics, HBM/HPI, and system-level testing, providing cutting-edge expertise for a faster time-to-market and maintaining strong relationships with EDA, IP, and foundry ecosystems.

Engineering Team

Design & Verification Team

Engineering

Human Resources Team

Engineering Team

About

Team members

Other teams at Tessolve

Design & Verification Team

Engineering

Human Resources Team