Hengfang Zhu

Hengfang Zhu has a diverse work experience in the semiconductor industry. Starting in 2009, Hengfang worked at Cypress Semiconductor Corporation in various design engineering roles, including Sr. Staff Design Engineer, Staff Design Engineer, and Sr. Design Engineer. During this time, Hengfang designed power and analog blocks for different memory systems, including 65nm ultra low power ASYNC SRAM and 40nm SONOS Flash Macro. Hengfang also contributed to the design of memory control sub-systems for a 28nm KGD QDR wide-IO SRAM.

In 2020, Hengfang joined Infineon Technologies as a Principal Design Engineer. Hengfang worked in this role until 2022, focusing on design engineering.

Currently, Hengfang is associated with TetraMem - Accelerate The World as a Sr. Principal Mixed-Signal Architect. In 2023, Hengfang will transition to the role of Director of Mixed-Signal Design.

Prior to Hengfang's industry experience, they worked as a Teaching Assistant at Rensselaer Polytechnic Institute in 2008 and as an Intern at Cypress Semiconductor in the same year.

Hengfang Zhu's work experience showcases their expertise in mixed-signal design and their contributions to the development of various semiconductor products.

Hengfang Zhu holds a Master of Science degree in Electrical and Electronics Engineering from Rensselaer Polytechnic Institute, which they obtained from 2007 to 2009. Prior to that, they completed their first Master's degree in Electrical Engineering from Zhejiang University between 2005 and 2007. Hengfang also completed their Bachelor of Science degree in Electrical Engineering from Zhejiang University, graduating in 2005. Hengfang Zhu's education history begins with their time at Hangzhou High School, but no specific dates or degrees were provided for that period.