John Schreck

John Schreck is the Chief Executive Officer at the Texas Institute for Electronics (TIE) since December 2022, leading a public-private partnership focused on advanced packaging solutions and heterogenous integration. Prior to TIE, John Schreck served as Senior Vice President of DRAM and 3DXP Engineering at Micron Technology from October 1998 to November 2021, and held the position of Vice President of DRAM Engineering. John Schreck began their career at Texas Instruments in June 1981 as a Distinguished Member of Technical Staff, co-managing the DRAM design department and previously serving as Productization Manager of TI's NOR Flash Department. John Schreck earned a Bachelor's degree in Electrical and Electronics Engineering from The University of Texas at Austin and a Master's degree in the same field from Rice University.