Stanley Chou

Stanley Chou is an experienced engineering professional currently serving as the Packaging Engineering Manager at 德州儀器 since May 2014. Prior to this role, Stanley worked as a Research Assistant at Shanghai Jiao Tong University from September 2013 to January 2014, where research focused on low-temperature copper bonding for 3D-IC vertical interconnects, including testing bonding strengths and presenting findings to industry professionals. Stanley holds a Bachelor's degree in Applied Chemistry and a Master's degree in Materials Sciences, both from National Chiao Tung University, with a remarkable academic score of 91.1/100 for the master's program.