William Ding

William Ding is a Senior Consultant at the Federal Reserve Bank of New York since September 2021, with previous experience at Capgemini as a Consultant/Developer Lead specializing in cloud services, cloud migration, and microservice architecture from October 2020 to September 2021. Prior to that, William served as a Software Engineer at Crestron Electronics from June 2015 to July 2020, contributing to IoT product development and designing web microservices using Java and Spring technologies. William's earlier roles include Software/Firmware Engineer at Distek, Inc., Design Engineer at Kulite Semiconductor Products Inc., Laboratory Research Assistant at NYU Tandon School of Engineering, and internships at Con Edison and Hyundai Auto Company. William holds a Master’s degree in Electrical Engineering from NYU Tandon School of Engineering and a Bachelor's degree in Mechatronical Engineering from Beijing Institute of Technology.