William Hyland

William Hyland currently serves as the Lead Associate Process & Equipment Engineer at the University of Chicago, where responsibilities include managing specialized tools in the Pritzker Nanofabrication Facility and collaborating with researchers to optimize semiconductor fabrication processes. Prior experience includes working as an Equipment Engineer at TSMC, focusing on enhancing manufacturing processes and managing tool installations for advanced technology nodes. William's academic background includes a Bachelor's degree in Chemical and Biomolecular Engineering from the University of Illinois Urbana-Champaign, alongside research roles in various laboratories where William contributed to projects in cannabinoid synthesis and quantum dot optimization.