Wayne Simpson

TCB provides specialty bonding of materials for application in CVD, PVD, sputter and semiconductor equipment. TCB has developed proprietary bonding techniques for joining cylinders of materials to supporting tubes, enabling the construction of very long cylindrical targets to coat large surface areas more cost effectively then planar targets. TCB successfully collaborated with engineers in the flat panel industry to develop a process where we can bond small or large surface area sputtering targets greater than 100 sq. feet. TCB also supports thin- film deposition of materials for many applications including solar. We at TCB are proud of our engineering accomplishments and continuing ability to innovate and develop technology to service our customers.