David Wang

David Wang has a diverse work experience starting from 1990 as a Systems Engineer at CAE-Link Flight Simulation. David then worked as a Final Test Engineer at Applied Materials from 1994 to 1996. David joined Tokyo Electron as a Senior Process Engineer in 1996 and worked there until 2004. From 2004 to 2006, David worked as a Senior Etch Process Engineer at Molecular Imprints. David then moved to Freescale Semiconductor where they held multiple roles from 2006 to 2015, including Senior Etch Process Engineer and Etch Development Process Engineer. In 2015, David joined NXP Semiconductors as a Senior Etch Process Engineer at their Austin Technology & Manufacturing Center. Currently, they are a Principal Field Applications Engineer at Tokyo Electron US, starting from August 2016.

David Wang received a Bachelor of Science (B.S.) degree in Electrical Engineering from The University of Texas at Austin between the years 1986 and 1990. In addition, they obtained a certification as a Certified Six Sigma Black Belt (CSSBB) from ASQ in December 2018.