William Lam

William Lam has extensive work experience in various high-profile positions. William began their career at Oracle Corporation (Sun Microsystems) in 1997, where they worked as a Senior Engineering Manager. William was responsible for managing and designing coarse grained processors and massively parallel processor arrays at both the chip and system level. During their time at Oracle, they gained experience in architecture, hardware design, and software development.

In 2005, they joined Micron and SanDisk as a Senior Director of Engineering. In this role, they oversaw architecture, software, firmware, and ASIC/SOC design in multiple locations across the globe, including the United States, Scotland, Israel, Italy, and China.

In 2014, William Lam joined Toshiba America Electronic Components, Inc. as the Vice President of Engineering. During their tenure, they focused on creating innovative products and developing business solutions for Fortune 500 customers. Their areas of expertise included data center technologies, cloud computing, machine learning, automotive applications, network security processors, and IoT/industrial and home automation technology.

Most recently, in 2019, they became the Executive Vice President/Principal at Cortex Computing Systems. Additional details about this role are not provided.

William Lam has a background in electrical engineering. William attended Stanford University, where they pursued a degree in electrical engineering. During their time at Stanford, they were also a Hertz Foundation Fellow. After completing their studies at Stanford, they went on to the University of California, Berkeley. At Berkeley, they furthered their education in electrical engineering and computer science (EECS). William's outstanding academic work at Berkeley earned him the Best Ph.D. Thesis Award, specifically the David J. Sakrison Memorial Prize.