Will Huang is a Senior Firmware Engineer at 冠捷科技有限公司, specializing in Android BSP and MCU firmware development with over 19 years of experience in product development. They have previously held positions at Foxconn and TPV, where they focused on automotive electronics, diagnostics, and multimedia systems for various platforms. Their expertise includes Android devices, automotive products, and embedded systems, making them a skilled leader in firmware project management. Will is currently pursuing a Master's degree in Electrical and Electronics Engineering at 華梵大學.
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