Bill Rubin

Bill Rubin has over 20 years of experience in the semiconductor industry. Bill began their career in 1997 as a Design Technology Engineer at Lexra Corp. In 2001, they moved to Quantum Corp as an ASIC Design Engineer, followed by a role as an SoC Design Engineer at Agere Systems in 2002. In 2005, they were a Design Engineer at Intel, and then a SoC Design Engineer at Texas Instruments in 2006. In 2008, they joined Broadcom Limited (formerly LSI Corp / Avago Technologies) as an IC Design Engineer. In 2017, they became a Physical Design Engineer at Intel Corporation and then a Physical Design Engineer at Marvell Technology in 2018. Most recently, they have been an ASIC Design and Physical Design Engineer at Trusted Semiconductor Solutions since 2020.

Bill Rubin obtained a Bachelor of Science (BS) in Computer Science and Engineering from the Massachusetts Institute of Technology, followed by a Master of Science (MS) in Electrical Engineering and Computer Science from the same institution.