Brent Li is a Principal Engineer at TSMC, bringing over 7 years of experience in New Product Introduction and Product Engineering in semiconductor backend operations. They have expertise in CoWoS package development, focusing on organic interposer integration with HBM3, alongside a background in flip chip package design and development. Previously, Brent worked as a Senior Package Integration Engineer at TSMC, a Test Solution Engineering-Product Integration Engineer at Micron, and a Customer Engineering Integration Engineer at an earlier company, where they collaborated with global teams to enhance product performance. Brent holds a Master's degree in Chemical Engineering from National Taiwan University of Science and Technology.
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