Doug Yu

Dr. Douglas Yu is Vice President of Integrated Interconnect & Packaging under Research and Development (R&D) at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), responsible for research and development of advanced packaging and system integration solutions. Prior to his appointment to Vice President in 2016, Dr. Yu was Senior Director of the Integrated Interconnect & Packaging Division.

Dr. Yu joined TSMC in 1994, serving in a variety of roles throughout his career including backend R&D, and developed technologies critical to the Company’s highly successful transition to copper process at the 0.13 micron generation. Dr. Yu also pioneered TSMC’s wafer-level system integration technologies, including Chip on Wafer on Substrate (CoWoS®), Integrated Fan-Out (InFO), and TSMC System on Integrated Chips (SoIC™), as well as their derivatives.