Shang Hou

Shang Hou is currently the Director at TSMC, where they lead high-performance packaging technology development with a focus on 2.5D packaging and CoWoS integration. They have previously held positions at TSMC as Deputy Director, Program Manager, and Technical Manager. Shang began their career as a Section Manager at Worldwide Semiconductor Manufacturing Corp. and earned a Bachelor of Science in Metallurgy and Materials Science from National Cheng Kung University, as well as a PhD in Materials Science from Stony Brook University.