Xichong Chen is a seasoned professional in materials science and engineering with extensive experience in the semiconductor industry and research. Currently serving as the PVD Process Engineering Manager at TSMC since June 2021, Xichong Chen has previously held significant positions at ASM from February 2011 to June 2021, including Manager of Key Account Technology for Taiwan and China, where responsibilities encompassed advancing ALD metal deposition products and optimizing processes for key customers. Prior experience includes a postdoctoral research fellowship at the University of Rochester, focusing on biocompatible hydrogels, and a Ph.D. in Materials Science in Chemical Engineering from the same institution. Xichong Chen also holds a Master’s degree in Materials Science and Engineering and a Bachelor’s degree in Materials Chemistry from Fudan University.
This person is not in any teams
This person is not in any offices