Junhua Shi is a seasoned professional with extensive experience in the semiconductor industry. Currently serving as Process Integration Manager at United Microelectronics Corporation (UMC) since August 2007, Junhua is responsible for managing 80nm/55nm/40nm Logic/eHV/SST eFlash/RFSOI process integration, overseeing tape out and yield enhancement projects. As a project leader, Junhua also focuses on platform improvement, new device development, new process setups, and Best Known Method (BKM) fan out. Previously, Junhua held the position of Diffusion Process Staff Engineer at UMC, gaining expertise in furnace, clean, implant, and single wafer tools, as well as tool assessment and qualification for capacity ramp-up. Prior experiences include working as a Senior Engineer in the Diffusion Department at Advanced Semiconductor Manufacturing Corporation Limited and as an Engineer in the Diffusion Department at 台积公司. Junhua Shi holds a Bachelor's degree from Harbin University of Science and Technology, earned in 2004.
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