Universal Instruments Corporation
Daniel Dimock is a Vision Software Engineer at Universal Instruments Corporation, having served in this role since August 2021. Prior to this position, Daniel worked as a Data Entry Specialist at Conduent and gained experience as a Technical Intern and Operations Associate at BAE Systems, where responsibilities included inspecting circuit cards for defects. Daniel's technical background also includes working as a Test Technician at The Raymond Corporation, conducting tests on forklift models and documenting issues. Daniel's early experience includes serving as a Counselor and Lifeguard with the Boy Scouts of America, contributing over four summers in various capacities. Daniel holds a Bachelor of Science in Computer Engineering from Binghamton University and an Associate of Science in Engineering Science from SUNY Broome Community College.
Universal Instruments Corporation
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We are a technology leader in the design and manufacture of precision automation solutions for the semiconductor and electronics manufacturing industry. With a lineage of more than 100 years, we are the longest-standing electronics assembly company. Our technology solutions are truly universal and span the range of assembly applications- from lighting to automotive, medical, computing, entertainment, mobility, industrial and more. We employ a highly technical workforce of ~ 500 employees. This expertise and passion to develop innovative solutions to solve our customer’s problems drive our 500+ strong patent portfolio. With 27,000+ systems delivered to date, we offer the broadest range of world-class equipment and services. We also enjoy strategic partnerships with today’s industry leaders, which enables us to stay on the leading edge of technology trends and to deliver the best solutions for the production of a wide variety of the most complex electronic circuits in the World. We offer solutions for a wide range of high-precision assembly needs, including Precision Automation for applications requiring versatile, high-accuracy, high-speed handling, inspection, and assembly. Advanced Packaging for applications requiring efficient and versatile multi-die high-accuracy assembly. Traditional to Complex Printed Circuit Board Assembly for applications requiring high-speed, high-accuracy surface mount placement and through-hole component insertion. Our cutting-edge smart manufacturing software provides real-time data to help manufacturers improve their overall operations. And, our world-renowned Advanced Process Lab (APL) offers solutions for all aspects of a product lifecycle- from prototyping, process development, and analytical services to advanced technology assembly.