Universal Instruments Corporation
Yevgeniy Parfilko is an experienced systems engineer currently employed at Universal Instruments Corporation since December 2017, alongside a role as a simulation consultant at Rochester Institute of Technology since May 2017. In the consulting position, Yevgeniy oversees a design and analysis team, ensuring the timely and budget-conscious completion of research contracts. Previous experience includes instruction as a machine shop instructor at Rochester Makerspace Inc., where responsibilities included training new members and managing equipment acquisition, and a co-op as a product engineer at BorgWarner Inc., assisting in the development and testing of engine timing systems. Yevgeniy began a career in research as a student researcher at the Geopolymer Research Lab, focusing on nonlinear impact simulations. Yevgeniy holds both a Master's and Bachelor's degree in Mechanical Engineering from Rochester Institute of Technology.
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Universal Instruments Corporation
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We are a technology leader in the design and manufacture of precision automation solutions for the semiconductor and electronics manufacturing industry. With a lineage of more than 100 years, we are the longest-standing electronics assembly company. Our technology solutions are truly universal and span the range of assembly applications- from lighting to automotive, medical, computing, entertainment, mobility, industrial and more. We employ a highly technical workforce of ~ 500 employees. This expertise and passion to develop innovative solutions to solve our customer’s problems drive our 500+ strong patent portfolio. With 27,000+ systems delivered to date, we offer the broadest range of world-class equipment and services. We also enjoy strategic partnerships with today’s industry leaders, which enables us to stay on the leading edge of technology trends and to deliver the best solutions for the production of a wide variety of the most complex electronic circuits in the World. We offer solutions for a wide range of high-precision assembly needs, including Precision Automation for applications requiring versatile, high-accuracy, high-speed handling, inspection, and assembly. Advanced Packaging for applications requiring efficient and versatile multi-die high-accuracy assembly. Traditional to Complex Printed Circuit Board Assembly for applications requiring high-speed, high-accuracy surface mount placement and through-hole component insertion. Our cutting-edge smart manufacturing software provides real-time data to help manufacturers improve their overall operations. And, our world-renowned Advanced Process Lab (APL) offers solutions for all aspects of a product lifecycle- from prototyping, process development, and analytical services to advanced technology assembly.